3M Scotch-Weld Epoxy Potting Adhesive | DP270 | 48.5ml | Box of 12

Potting and Encapsulation Adhesive

Two-part Epoxy (Resin + Hardener)

48.5 ml cartridge

Box of 12 cartridges

Used for potting and encapsulating electronic assemblies, sensors, transducers, PCBs, and avionics modules to protect them from vibration, moisture, and environmental stress.

• Low viscosity for easy flow and complete coverage

• Excellent dielectric strength and insulation

• High bond strength on metals, plastics, and ceramics

• Low exotherm - safe for heat-sensitive components

• Resistant to moisture, vibration, and thermal cycling

• Room-temperature curing with optional heat acceleration

• Flows into every gap: Low viscosity lets it self-level around components and fill voids for a uniform protective layer, rather than leaving air pockets that trap moisture or vibration stress.
• Excellent electrical insulation: Volume resistivity of 2.37 × 10¹⁵ Ω-cm and a dielectric constant of 3.87 at 1 kHz, giving reliable insulation for sensitive electronics.
• Room-temperature cure, or faster if needed: Cures fully in 24 hours at 23°C, with accelerated options — 4 hours at 50°C, 60 minutes at 80°C, or just 30 minutes at 100°C — for production lines that can't wait.
• Workable pot life: About 70 minutes at 23°C before it starts to set, giving enough time to mix, dispense and pot components properly.
• Bonds a wide range of substrates: Tested on aluminium, copper, steel, FR-4 composites and common plastics like polycarbonate and PVC.

• Electronic Component Potting: Encapsulating PCBs, sensors and connectors against moisture, dust and vibration.
• Electrical Insulation: Sealing terminals and junctions where high dielectric strength matters.
• Vibration & Thermal Protection: Protecting assemblies exposed to mechanical shock or thermal cycling.
• Moisture Sealing: Environmental sealing of outdoor or exposed electronic housings.
• Production-Line Assembly: Accelerated cure options suit lines that need faster turnaround than a 24-hour room-temperature cure.

Step 1: Surface Preparation — Remove contaminants from substrates via solvent wipe, abrasion, or substrate-specific etching as needed.

Step 2: Mix — Combine resin and hardener at the specified 1:1 ratio by volume (1:1.06 by weight), mixing thoroughly.

Step 3: Apply — Dispense evenly around and over the components to be potted, keeping to a bondline thickness of 3–5 mils where bonding rather than full potting is the goal.

Step 4: Work Within Pot Life — Complete application within about 70 minutes at 23°C before the mixture begins to set.

Step 5: Cure — Allow to cure at room temperature (24 hours for full cure, handling strength in about 6 hours), or use an accelerated schedule (4h/50°C, 60min/80°C, or 30min/100°C) where production speed matters.